Product Detail

TPC 812 is the Cooler Master Reference Cooler for optimal Performance and is a high end cooling system with perfect performance for overclocking and silent cooling. TPC 812 is the first-ever CPU heatsink to use vertical vapor chamber technology and combine it with heatpipe technology: the synergy of both Technologies working in tandem delivers the top cooling performance.

Features:

• The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers.
• Ready for overclocking, benchmarking and silent cooling.
• The first-ever CPU heatsink to use vertical vapor chamber technology.
• 100% pure polished copper base – combined with improved soldering technologies for the best thermal transfer.
• Special fin design – heatsink receives concentrated cold airflow.
• Improved air pressure design and fan mounting system.


Vertical Vapor Chamber Technology

The first-ever CPU heatsink to use vertical vapor chamber technology. The heat form the CPU hot spots get spread and faster transferred to the fins resulting in improved efficiency.

Synergy Cooling of 2 Technologies

The TPC 812 uses 2 separate cooling technologies to transfer heat – heat pipes and vertical vapor chambers, substantially allowing much improved cooling performance.

Special Fin Design

Fins being special design to concentrate the cold air to Heatsink area.

100% Pure Polished Copper Base with Improved Soldering Technologies

The source of Innovations is inside of details, based on this rule we optimize the base, fins and soldering.